A Key for the Packaging Industry? Intel’s New Connected Logistics Platform

With package damage and loss still being an issue in the packaging and transport industry, Intel now offers their Connected Logistics Platform. Low-cost IoT sensors that are attached to packages collect data to inform about damage, location, shock, tilt, temperature and humidity of the shipped goods.

According to the European Space Agency’s Real-Time Intelligent Cargo Monitoring project, the struggle in the logistics industry is real: Round about 30 percent of all shipments are either damaged or delayed. Another 30 percent of delayed shipments are perishable goods that go to waste during their transportation. Some never even reach their destination.

Now Intel offers a new Connected Logistics Platform (Intel CLP) that could be a key to reducing package damage and loss in the packaging and transportation industry. With low-cost IoT sensors, the Intel CLP lets businesses monitor the condition and location of products within the supply chain. The platform uses sensor tags, gateways and cloud components to monitor packages from loading to unloading.

Smart Sensors Collect All Relevant Data

One of Intel’s sensors of their CLP is a single-use sensor tag that is attached to a standard deliverable good or a perishable product. The sensor collects data points on location, shock, tilt and damage. When it comes to food products the sensor informs the provider about atmospheric conditions, such as temperature and humidity. So, if a package is damaged, the sensor directly sends an alert. That means that the time when no one knew what happened or where the parcel got damaged, is over – thanks to Intel’s invention. Before reaching its destination, the sensors already transmit all information – if it’s necessary.

“Imagine the Possibilities of Shipments that are Smart and Connected”

According to Tony Romero, responsible for Planning and Logistics at Intel, Intel ships over 170.000 tons of goods and materials every year: “Imagine the possibilities when these shipments are smart and connected.” The data that will be gathered and communicated during the transportation shall help to improve numerous business decisions like rerouting if the demand shifts or even intercepting damaged shipments.

The collected data will be sent to a gateway by using a proprietary wireless sensor protocol. If a sensor is unable to communicate with the gateway due to a blocked signal path, for example because it’s at the bottom of a pallet, it will reroute through other sensors in its proximity establishing a secondary link. The gateway is battery-powered, collects the data and alerts if it’s required. It communicates with industry developed cloud-based tracking applications.

To reduce the initial set-up costs, the IoT sensors communicate with a low-cost proprietary wireless sensors network, instead of an expensive 4G connection. With the entire project Intel will provide a low-cost IoT solution for companies.

We’re quite excited about this project. What do you think about it? Do you know other great technologies reducing package damage and loss could? Tell us in the comment section below.